Bao-Anh Nguyen is the Co-founder and Chief Executive Officer of VSAP LAB, an advanced semiconductor packaging Lab-Fab headquartered in Da Nang, Vietnam. With more than 20 years of experience in semiconductor IP development, chiplet interconnect technologies, and multi-die system architecture, Bao-Anh has held senior leadership positions at eSilicon, Synopsys Vietnam, and Mixel Vietnam, where he built and scaled high-performing engineering organizations and led the development of industry-leading semiconductor product lines. Bao-Anh’s expertise spans high-speed interface IP, die-to-die connectivity, UCIe, DDR, HBM architectures, and system-level integration for advanced semiconductor products. At VSAP LAB, Bao-Anh is driving the development of a comprehensive advanced packaging ecosystem that integrates package design, simulation, process development, prototype manufacturing, testing, and technology transfer. Through this work, Bao-Anh is committed to strengthening Vietnam’s position in the global semiconductor value chain and enabling customers to accelerate the delivery of advanced chip products with reduced technical risk and enhanced manufacturing readiness.